TIF500-50-11E High Performance Thermal Pad Soft Silicone Thermal Cooling Pad For AI Processors Cooling
Product descriptions
TIF®500-50-11E Series is a well-balanced, general-purpose thermal pad. It offers High thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features:
> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
| Typical Properties of TIF®500-50-11E Series |
| Property | Value | Test method |
| Color | Dark Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.3 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) |
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 9.0 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 |
| 5.0 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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TIF500-50-11E High Performance Thermal Pad Soft Silicone Thermal Cooling Pad For AI Processors Cooling Images
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